Since mid-2017 we’ve been talking about the impending arrival of USB 3.2, the next version of the USB Implementers Forum’s ubiquitous standard for connecting external devices. With 3.2 serving as both an upgrade to the feature set and a physical layer tweak to provide more bandwidth, according to the USB-IF at MWC 2019, the technology will finally come to fruition this year. According to the organization that sets the standards for the USB interface, discrete USB 3.2 controllers capable of supporting the standard’s new 20 Gb/s Type-C mode will be available this year. Being a specification-setting group, the USB Implementers Forum does not name companies that develop actual chips. But given the limited number of companies that develop standalone USB controllers, the names of the suspects are pretty well known. Since discrete USB controllers are used mostly by high-performance desktop systems, we’re likely to see the first USB 3.2 chips to land on high-end motherboards first. In which case we could see motherboard venders showing off product sometimes this summer, or maybe a bit later. Meanwhile peripherals will likely lag a bit for compatibility testing a...